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Apple ( AAPL ) supplier Qualcomm ( QCOM ) quintupled its content in the Samsung Galaxy S7 smartphone as radio frequency-chipmaker Broadcom ( AVGO ) repeatedly lost share to rival Qorvo ( QRVO ), a ChipWorks teardown shows. The ChipWorks teardown was last week, but it was highlighted in a research report Monday by Needham analyst Rajvindra Gill. InvenSense ( INVN ), another Apple supplier, apparently lost the GS7 gyroscope to STMicroelectronics ( STM ). InvenSense stock was down 1.5% in midday trading on the stock market today . STMicro stock was up a fraction. Three Skyworks Solutions ( SWKS ) chips were completely replaced in the GS7. Key winners in getting their chips inside the new phone, besides Qualcomm and Qorvo, included NXP Semiconductors ( NXPI ) and Maxim Integrated Products ( MXIM ). Although Broadcom retained a power amplifier, rival Qorvo swiped two Broadcom components from the GS7. But Broadcom replaced a Skyworks multiband module (a power amplifier). Last week, Broadcom CEO Hock Tan bragged that the chipmaker has increased its content by 20% every year for its “North American customer,” which analysts said is the Apple iPhone, and that another bump is expected with the release of the next iPhone, the iPhone 7, due out in September. Meanwhile, though, Broadcom is de-emphasizing its mobile unit, which will comprise 23% of Q2 sales, down from 32% in Q1, as smartphone shipments slow amid a saturated market. Samsung lowered its own chip content in the GS7 vs. the GS6. Qualcomm took four chips (including the application processor) from Samsung and replaced Cirrus Logic ( CRUS )/Wolfson on an audio chip. SK Hynix, NXP and Maxim each replaced a Samsung component. But Samsung swapped STMicroelectronics’ touch controller in the GS6 for its own controller in the GS7. And Texas Instruments ( TXN ) lost the wireless power receiver to Integrated Device Technology ( IDTI ). Scalper1 News
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